Super-Digital (SD) Flash Card with Asymmetric Circuit Board and Mechanical Switch

ABSTRACT

A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an external Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Dividers between openings in the upper case that expose the SD contact pads also support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB. A user-slidable switch may be slanted to compensate for the PCB slant. The PCB may have a flex section to facilitate the slant without a slanted switch.

RELATED APPLICATION

This is a continuation-in-part (CIP) of the co-pending application for“Electronic Data Storage Medium with Fingerprint VerificationCapability”, U.S. Ser. No. 11/624,667 filed Jan. 18, 2007, which is acontinuation of U.S. Pat. No. 7,257,714. This application is acontinuation-in-part (CIP) of the co-pending application for “Removableflash integrated memory module card and method of manufacture”, U.S.patent application Ser. No. 10/913,868, filing date: Aug. 6, 2004 and aCIP of “Secure-Digital (SD) Flash Card with Slanted Asymmetric CircuitBoard”, U.S. Ser. No. 11/309,844 filed Oct. 11, 2006.

FIELD OF THE INVENTION

This invention relates flash-memory cards, and more particularly tomanufacturing a flash card with a slanted printed-circuit board (PCB).

BACKGROUND OF THE INVENTION

Flash-memory cards using standards such as compact-flash (CF),Multi-Media Card/Secure Digital (MMC/SD), and Sony's MemoryStick arepopular today. Such flash cards may be used in consumer devices such asdigital cameras, music players, phones, palm or other portablecomputers, and may be inserted into personal computers and printers.Various extensions of these standards exist, such as Super Digital, anextension of Secure Digital (SD) that does not have all the securityfeatures and digital-rights management features of SD. MMC/SD is populardue to its small size, about the size of a postage stamp.

Data files stored on such as flash card, or on a more traditional floppydisk or diskette may require a password for access, or may useencryption to secure the data within the file. Confidential documentscan be delivered over a network by adding safety seals and impressions.However, the confidential data is at risk due to breaking of thepasswords, encryption codes, safety seals and impressions, therebyresulting in unsecure transfer of the information.

The grand-parent application (U.S. Ser. No. 09/478,720, filed Jan. 6,2000) disclosed an electronic data storage medium that had fingerprintverification capability. FIG. 1 is a schematic circuit block diagramillustrating an electronic data storage medium disclosed in thegrand-parent application.

The electronic data storage medium with fingerprint verificationcapability can be accessed by external computer 9 using input/outputinterface circuit 5, which may use a Personal-Computer Memory CardInternational Association (PCMCIA), RS-232, or similar interface tocommunicate. The electronic data storage medium can be located inside oroutside of the external computer.

The electronic data storage medium with fingerprint verificationcapability is packaged in card body 1, and includes processing unit 2,memory device 3, fingerprint sensor 4, input/output interface circuit 5,display unit 6, power source 7, and function key set 8.

Memory device 3 can be a flash memory device that stores data files.Fingerprint sensor 4 scans a fingerprint of a user to generatefingerprint scan data. Processing unit 2 connects to other componentsand can operate in various modes, such as a programming mode, a dataretrieving mode, and a data resetting mode. Power source 7 supplieselectrical power to processing unit 2. Function key set 8 allows theuser to input a password that is verified by processing unit 2. Displayunit 6 shows the operating status of the electronic data storage medium.

The electronic data storage medium may be a subset of the electronicdata storage medium with fingerprint verification capability. Theelectronic data storage medium is packaged in card body 1, and includesprocessing unit 2, memory device 3, and input/output interface circuit5. While such an electronic data storage medium is useful, manufacturingmethods and product designs are desired that can be cost-effectivelyproduced. In particular, designs for making the card body or casing thatencapsulates the electronic components are desired. To reduce the costand size, designs of the electronic data storage medium that eliminatesome costly components, such as the fingerprint sensor, function keyset, and display, are desirable. An external power source may furtherreduce costs and size. Such device designs can allow a low-costelectronic data storage medium to be manufactured.

Another related application, U.S. Ser. No. 11/309,844, disclosed aflash-memory device with a slanted PCB circuit board. The slanting ofthe PCB allows the flash-memory and controller chips to be mounted onone side, and the metal contacts for the SD standard to be on the otherside of the PCB. The PCB is tilted to allow both the chips and thecontact pads to fit within the card body without otherwise increasingthe thickness of the card body. Further refinements to the flash-memorydevice with the slanted PCB are desired.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic circuit block diagram illustrating an electronicdata storage medium disclosed in the grand-parent application.

FIG. 2 shows a parts view of a Secure-Digital flash card assembled usingan ultrasonic-press process with a slanted switch.

FIG. 3 shows a top view of a final assembled SD flash card.

FIGS. 4A-B show the upper case in more detail.

FIGS. 5A-B show the circuit-board assembly in detail.

FIG. 6 is a view of a mechanical switch.

FIGS. 7A-B show a circuit-board assembly with pads for a mechanicalswitch.

FIG. 8 is a cross-sectional diagram highlighting the slanting of thecircuit board.

FIG. 9 is a cross-sectional diagram highlighting a circuit board with aflex transition section for overall slanting.

FIG. 10 is a cross-sectional diagram highlighting a circuit board with aflex main and transition section for overall slanting.

FIG. 11 is a cross-sectional diagram highlighting a flex circuit boardfor overall slanting.

DETAILED DESCRIPTION

The present invention relates to an improvement in flash-memory cards.The following description is presented to enable one of ordinary skillin the art to make and use the invention as provided in the context of aparticular application and its requirements. Various modifications tothe preferred embodiment will be apparent to those with skill in theart, and the general principles defined herein may be applied to otherembodiments. Therefore, the present invention is not intended to belimited to the particular embodiments shown and described, but is to beaccorded the widest scope consistent with the principles and novelfeatures herein disclosed.

The inventors have developed a variety of manufacturing methods forelectronic data storage medium devices such as flash-memory cards thatcan replace hard disk drives with solid-state flash memory. Flash memorychips currently employ electrically-erasable programmable read-onlymemory (EEPROM) are the primary storage medium. Such flash memory ismore rugged than rotating magnetic disks.

The inventors have realized that the card body may be constructed from atwo-piece casing that encloses a printed-circuit board assembly (PCBA)that has a circuit board with flash-memory and controller chips mountedthereon. The two-piece casing can be assembled together and sealed in avariety of ways, such as with snaps, tabs and slots, ultrasonic ridges,adhesives, and screw fasteners.

The inventors have further realized that the card body can conform toexisting flash-card standards, such as Secure Digital (SD). However,Secure Digital is a particularly thin and flat standard compared toother standards such as Compact Flash. Being able to mount the chips ona PCB within such as SD card is challenging. However, the inventors havediscovered that the PCB inside a SD card may be slanted within the SDcard body for a better fit. The slanting of the PCB allows theflash-memory and controller chips to be mounted on one side, and themetal contacts for the SD standard to be on the other side of the PCB.The PCB is tilted to allow both the chips and the contact pads to fitwithin the card body without otherwise increasing the thickness of thecard body.

However, slanting the PCB has an unintended side effect. A write-protectswitch may be mounted to the PCB. When the PCB is slanted, thiswrite-protect switch is likewise slanted. Having a slanted switch canannoy the user and may have an awkward appearance.

The inventors have discovered that the switch may be constructed with aslant to compensate for the slanting angle of the PCB that the switch ismounted to. Furthermore, the PCB may include a flexible portion thatallows the board to have an overall slant or offset while still having aswitch that is parallel to the plastic casing.

FIG. 2 shows a parts view of a Secure-Digital flash card assembled usingan ultrasonic-press process with a mechanical switch. PCBA 41 isenclosed by upper case 20 and lower case 30. PCBA 41 is a circuit boardsuch as a printed-circuit board (PCB) with wiring traces, and has aflash-memory chip and a controller chip and components soldered to thebottom surface (hidden in this view) of the circuit board. PCBA 41 alsohas SD contact pads 42 formed along the front edge of the circuit board.SD contact pads 42 mate with socket pads on a SD socket that theSecure-Digital flash card fits into, such as on a host or in anelectronic device.

Upper case 20 has contact openings 28 between dividers 29 along thefront side. SD contact pads 42 are exposed by contact openings 28between dividers 29 when PCBA 41 is assembled into upper case 20, thusallowing SD contact pads 42 to make electrical connection when insertedinto an SD socket.

During assembly, PCBA 41 is fitted inside upper case 20. PCBA 41 may befitted at a slanting angle within upper case 20 (See FIG. 8) to allow SDcontact pads 42 to fit within contact openings 28 between dividers 29while still having room within upper case 20 and lower case 30 for chipsmounted to the bottom side of PCBA 41. The slanting angle may be 1-2degrees in some embodiments, depending on the length of and thethickness between the upper and lower cases.

The sub-assembly of PCBA 41 inside upper case 20 is then fitted to lowercase 30. Positioning posts formed at the corners of upper case 20 fitinto positioning holes in lower case 30 to help align cases 20, 30during assembly. Ribs 36 in lower case 30 provide more rigidity to theassembly underneath contact pads 42.

Since PCBA 41 may be at a slanting angle within upper case 20 and lowercase 30, supporting ribs 36 may be added to lower case 30 to supportPCBA 41 at this slanting angle. Dividers 29 on the end of upper case 20also help to position PCBA 41 at a slanting angle within cases 20, 30 bypushing down the insertion end of PCBA 41.

Dividers 29 may touch the top surface of PCBA 41, providing supportbetween PCBA 41 and upper case 20. This slanting angle allows forthicker chips at the far end of PCBA 41, on the bottom surface of PCBA41.

SD contact pads 42 at the insertion end of PCBA 41 are lowered withinthe casing because contact openings between dividers 29 in upper case 20force SD contact pads 42 to be lower within the casing (See FIG. 8).

Switch 70 is mounted to PCBA 41 and is exposed by switch opening 34 onlower case 30 and by switch opening 25 on upper case 20. Switch 70 canbe a slidable or sliding switch that is used to activate write orerasure protection, making the flash memory read-only when switch 70 isactivated by the user. Switch 70 has a slanting angle that is aboutequal to and an inverse of the slanting angle of PCBA 41. When switch 70is assembled, the inverse slant of switch 70 compensates for theslanting angle of PCBA 41.

FIG. 3 shows a top view of a final assembled SD flash card. FIG. 3 showsa top view from the front of the final assembled flash-card device, withupper case 20 covering PCBA 41. SD contact pads 42 extend from frontopenings between dividers 29 in upper case 20. Switch 70 is visible onone side, between cases 20, 30. Switch 70 appears to be parallel tocases 20, 30 despite PCBA 41 being at a slanted angle, due to thecompensating slant of switch 70.

SD contact pads 42 can be inserted into a SD socket such as on a hostcomputer, allowing the SD card to be read as a mass-storage device,replacing a rotating hard disk. Mass-storage devices are read in largeblocks or streams of data, rather than as randomly-addressable words.

FIGS. 4A-B show the upper case in more detail. FIG. 4A shows the top oroutside view of upper case 20. Upper case 20 has contact openings 28between dividers 29. Switch opening 25 is visible.

FIG. 4B shows the bottom or inside view of upper case 20. Positioningposts 26 formed at the corners of upper case 20 fit into positioningholes in lower case 30 to help align cases 20, 30 during assembly.Contact openings 28 are formed between dividers 29. Switch opening 25allows switch 70 to be reached by a user when PCBA 41 is fitted intocases 20, 30. The shape of switch opening 25 may include a pair ofdepressions to temporarily lock the position of switch 70 into the on oroff position.

Ultrasonic ridges 24 are formed on the perimeter rim of upper case 20touch the rim of lower case 30 as cases 20, 30 are fitted together.Ultrasonic energy is applied while pressing cases 20, 30 together,causing ultrasonic vibrations along ultrasonic ridges 24. Ultrasonicridges 24 are heated by the friction of rubbing against the rim of lowercase 30 and the pressure from the ultrasonic press machine. This heatingpartially melts the plastic of ultrasonic ridges 24, causing ultrasonicridges 24 to meld into lower case 30, bonding cases 20, 30 together.PCBA 41 is thus encased within upper case 20 and lower case 30.

FIGS. 5A-B show the circuit-board assembly in detail. In the top view ofFIG. 5A, PCBA 41 includes a circuit board with wiring traces on severallayers, and vias or other inter-layer connections. SD contact pads 42are formed along the front (insertion) end of circuit board 40 using alayout dictated by the SD standard. Switch 70 is attached to circuitboard 40 by switch positioning tabs 76 that can fit through holes incircuit board 40 before soldering.

In the bottom view of FIG. 5B, flash-memory chip 44 is mounted to thebottom surface of circuit board 40. Controller chip 46 is also mountedto circuit board 40, between flash-memory chip 44 and the insertion endof circuit board 40, which has SD contact pads 42 on the top surface asshown in FIG. 5A. Controller chip 46 can have an SD or other businterface to communicate with a host over SD contact pads 42. Controllerchip 46 can also have a flash controller that reads, erases, and writesblocks of data to flash-memory chip 44, perhaps including wear-levelingand address re-mapping logic and tables. Components 45 can include otherelectrical components that are soldered to circuit board 40, such asresistors, capacitors, LED's, etc. Switch 70 is mounted to this side ofcircuit board 40.

FIG. 6 is a view of a mechanical switch. Switch 70 is a switch assemblyhaving sliding switch 78 that slides within slot 77 when the userapplies a sliding force. Four switch positioning tabs 75 are located atthe four corners of the switch assembly. Switch positioning tabs 76 atone end of switch 70 are raised compared to switch positioning tabs 76on the other end of switch 70 so that switch 70 has a slanted angle whensoldered to circuit board 40. One pair of switch positioning tabs 76 canbe raised by bending leads, or can be formed with different thicknessesor lengths during fabrication of switch 70.

FIGS. 7A-B show a circuit-board assembly with pads for a mechanicalswitch. In the top view of FIG. 7A, PCBA 41 includes a circuit boardwith wiring traces on several layers, and vias or other inter-layerconnections. SD contact pads 42 are formed along the front (insertion)end of circuit board 40 using a layout dictated by the SD standard.

In the bottom view of FIG. 7B, controller chip 46 is soldered to circuitboard 40. Controller chip 46 can have an SD or other bus interface tocommunicate with a host over SD contact pads 42. Controller chip 46 canalso have a flash controller that reads, erases, and writes blocks ofdata to flash-memory chip 44, perhaps including wear-leveling andaddress re-mapping logic and tables.

Components 45 can include other electrical components that are solderedto circuit board 40, such as resistors, capacitors, LED's, etc that aresoldered to other pads on circuit board 40.

Pads 84 are soldered to switch positioning tabs 76 on switch 70. pads 84can include through-holes when switch positioning tabs 76 are pointeddownward as pins, or can be flat pads without holes when switchpositioning tabs 76 are bent flat.

FIG. 8 is a cross-sectional diagram highlighting the slanting of thecircuit board. Circuit board 40 has flash-memory chip 44 and controllerchip 46 and other components mounted to the bottom surface by the farend, while SD contact pads 42 are formed on the top surface by theinsertion end. Lower case 30 and upper case 20 encase circuit board 40and its components.

Contact openings between dividers 29 in upper case 20 allow SD contactpads 42 to be exposed to the host. Dividers 29 on upper case 20 (thecase on the bottom in FIG. 8) force the surface of circuit board 40downward (upward as shown in FIG. 8) to slant circuit board 40 encasedwithin cases 20, 30. The tops of flash-memory chip 44 and controllerchip 46 can press against the inside surfaces of lower case 30 to forcethe non-insertion end of circuit board 40 upward (downward as shown inFIG. 8) to slant circuit board 40.

Since chips 44, 46 are relatively thick, circuit board 40 is slantedupward at the far end, allowing more space for chips 44, 46. Theposition of the insertion end of circuit board 40 with SD contact pads42 is fixed by the SD mechanical specification to be near the devicecenter-line, at about half the device thickness. Thus circuit board 40is near the center-line at the insertion end, but slants upward towardthe far end, providing additional space for chips 44, 46. This slantingof circuit board 40 more efficiently uses the volume within upper andlower case 20, 30. If circuit board 40 were to have no slant and remainat the device center-line, chips 44, 46 would extend above upper case20, requiring that upper case 20 be raised, increasing device thickness.

Flex Boards—FIGS. 9-11

The inventors have also realized that the circuit board may include aflexible or flex-board portion to achieve the benefits of a slantedcircuit board. A standard, non-mechanical switch may be used in theembodiments of FIGS. 9-11.

FIG. 9 is a cross-sectional diagram highlighting a circuit board with aflex transition section for overall slanting. Circuit board 40 (FIG. 8)is replaced by a multi-section circuit board having rigid main section102, flex transition section 110, and rigid contact section 104.Flash-memory chip 44 and controller chip 46 are soldered to rigid mainsection 102, which can be a standard PCB. Contact pads 42 are formed onrigid contact section 104, which can also be a standard PCB. Thussections 102, 104 are relatively thick, rigid boards.

Flex transition section 110 can be a thin flexible carrier substratesuch as a thin sheet of polymer material with wiring traces printed onit with pads formed on both ends to allow flex transition section 110 tobe soldered to both rigid main section 102 and rigid contact section104. Signals for contact pads 42 are carried across flex transitionsection 110 to rigid main section 102.

Flex transition section 110 allows rigid main section 102 to be closerto upper case 20, providing more spacing for flash-memory chip 44 andcontroller chip 46 between rigid main section 102 and lower case 30.Contact pads 42 can still be located at about the midpoint between cases20, 30, with dividers in upper case 20 positioning rigid contact section104 at the desired location.

Since chips 44, 46 are relatively thick, rigid main section 102 of thecircuit board is higher at the far end, allowing more space for chips44, 46. The position of the insertion end of the circuit board, rigidcontact section 104 with SD contact pads 42 is fixed by the SDmechanical specification to be near the device center-line, at abouthalf the device thickness. Thus the circuit board is near thecenter-line at the insertion end, but is higher at the far end,providing additional space for chips 44, 46. This slanting of thecircuit board more efficiently uses the volume within upper and lowercase 20, 30.

FIG. 10 is a cross-sectional diagram highlighting a circuit board with aflex main and transition section for overall slanting. Circuit board 40(FIG. 8) is replaced by a multi-section circuit board having flex mainsection 108, flex transition section 110, and rigid contact section 104.Flash-memory chip 44 and controller chip 46 are soldered to flex mainsection 108, which can be an extension of flex transition section 110.Contact pads 42 are formed on rigid contact section 104, which can be astandard PCB. Thus sections 108, 110 are relatively thin and flexible,while section 104 is relatively thick and rigid.

Flex transition section 110 can be a thin flexible carrier substratethat has pads formed on one end to allow flex transition section 110 tobe soldered to rigid contact section 104. Signals for contact pads 42are carried across flex transition section 110 to flex main section 108.

Flex transition section 110 allows flex main section 108 to be closer toupper case 20, providing more spacing for flash-memory chip 44 andcontroller chip 46 between flex main section 108 and lower case 30.Contact pads 42 can still be located at about the midpoint between cases20, 30, with dividers in upper case 20 positioning rigid contact section104 at the desired location.

Since chips 44, 46 are relatively thick, flex main section 108 of thecircuit board is higher at the far end, allowing more space for chips44, 46. The position of the insertion end of the circuit board, rigidcontact section 104 with SD contact pads 42 is fixed by the SDmechanical specification to be near the device center-line, at abouthalf the device thickness. Thus the circuit board is near thecenter-line at the insertion end, but is higher at the far end,providing additional space for chips 44, 46. This slanting of thecircuit board more efficiently uses the volume within upper and lowercase 20, 30.

FIG. 11 is a cross-sectional diagram highlighting a flex circuit boardfor overall slanting. Circuit board 40 (FIG. 8) is replaced by a thinflexible circuit board or chip carrier having flex main section 108,flex transition section 110, and flex contact section 112. Flash-memorychip 44 and controller chip 46 are soldered to flex main section 108,which can be an extension of flex transition section 110. Contact pads42 are formed on flex contact section 112, which can also be anextension of flex transition section 110. Thus sections 108, 110, 112are relatively thin and flexible.

Flex transition section 110 allows flex main section 108 to be closer toupper case 20, providing more spacing for flash-memory chip 44 andcontroller chip 46 between flex main section 108 and lower case 30.Contact pads 42 can still be located at about the midpoint between cases20, 30, with dividers in upper case 20 positioning flex contact section112 at the desired location.

Since chips 44, 46 are relatively thick, flex main section 108 of thecircuit board is higher at the far end, allowing more space for chips44, 46. The position of the insertion end of the circuit board, flexcontact section 112 with SD contact pads 42 is fixed by the SDmechanical specification to be near the device center-line, at abouthalf the device thickness. Thus the circuit board is near thecenter-line at the insertion end, but is higher at the far end,providing additional space for chips 44, 46. This slanting of thecircuit board more efficiently uses the volume within upper and lowercase 20, 30.

Alternative Embodiments

Several other embodiments are contemplated by the inventors. Forexample, while a connector and a controller chip for the SD protocol hasbeen described, other bus protocols and physical connectors could besubstituted, such as small-computer system interface (SCSI), compactflash, serial AT attachment (SATA), and PCI Express, ExpressCard,Firewire (IEEE 1394), integrated device electronics (IDE), Multi-MediaCard (MMC), etc. While Secure-Digital (SD) has been described, othervariations of SD may be substituted, such as Super Digital, which maynot have some security features of SD.

Controller chip 46 and flash-memory chip 44 may be packaged in a varietyof integrated circuit packages, such as Thin-Outline Small Package(TOSP), Ball-Grid Array (BGA), Land Grid Array (LGA), Chip-On-Board(COB), or in a multi-chip package. Switch 70 can be a metal switch forsurface mounting or can be made from other material. The slidableportion of the switch may be metal or plastic when the switch housing ismetal.

The upper and lower cases could be formed from metal in someembodiments, such as when using screws, or could be plastic, such as forultrasonic bonding. Combinations of plastic and metal could be used. Theform factor for the flash-card device could vary.

Directional terms such as upper, lower, up, down, top, bottom, etc. arerelative and changeable as the device is rotated, flipped over, etc.These terms are useful for describing the device but are not intended tobe absolutes. In some embodiments the lower case could be smaller thanthe upper case, or vice-versa.

An alternative process may use heat-activated adhesive film, or highviscosity adhesives. The adhesive can be applied to the case surface bymanual or automatic using dispensing machine. After dispensing adhesivesonto the case surface, immediately press the case against PCBA. A pressfixture may be used to hold the case and PCBA in position. The curingtime is about several minutes.

Various combinations of processes may be used. For example, adhesivefilms may be used with a screw-together method rather than withsnap-tabs. Alignment sockets may be added to other embodiments. Centerlines or more numerous ridges may be added to stiffen the upper or lowercases. Various cosmetic features, decals, and indicia may be added.

Rather than mount packaged IC's onto the surfaces of the circuit board,unpackaged die may be mounted using die-bonding techniques. Usingunpackaged die rather than packaged die may reduce the size and weightof the PCBA.

Snap-tabs with more complex movable latching teeth or extensions orlocking portions may also be used in many variations. Differentthicknesses and dimensions can be substituted for the examples given.The number and arrangement of chips may vary.

Various design features such as cutouts, holes, supporting undersideribs, or bumps can be added. A variety of materials may be used for theconnector, circuit boards, metal pads, cases, etc. Plastic cases canhave a variety of shapes and may partially or fully cover differentparts of the circuit board and connector, and can form part of theconnector itself. Metal covers rather than plastic may be used in someembodiments. Various features can have a variety of shapes and sizes.Oval, round, square, rectangular, trapezoidal, and other shapes may beused.

Rather than use the flash-card device only for flash-memory storage,additional features may be added. For example, a music player mayinclude a controller for playing audio from MP3 data stored in the flashmemory. An audio jack may be added to the device to allow a user to plugin headphones to listen to the music. A wireless transmitter such as aBlueTooth transmitter may be added to the device to connect to wirelessheadphones rather than using the audio jack. Infrared transmitters suchas for IRDA may also be added. A BlueTooth transceiver to a wirelessmouse, PDA, keyboard, printer, digital camera, MP3 player, or otherwireless device may also be added. The BlueTooth transceiver couldreplace the connector as the primary connector. A Bluetooth adapterdevice could have a connector, a RF (Radio Frequency) transceiver, abaseband controller, an antenna, a flash memory (EEPROM), a voltageregulator, a crystal, a LED (Light Emitted Diode), resistors, capacitorsand inductors. These components may be mounted on the PCB before beingenclosed into a plastic or metallic enclosure. Of course, the size ofthe flash-card device may increase.

A fingerprint scanner, display, keypad, power supply, or otheraccessories could be added to the flash-drive device with suitablechanges to the casing to allow space and user access to these devices ifneeded. Alternately, the flash device may delete these components andjust have input/output interface circuit 5, processing unit 2, and aflash memory device in the arrangement of FIG. 1. Power may be suppliedthrough the connector. Input/output interface circuit 5 may beintegrated with processing unit 2 as controller chip 45.

An indicator lamp such as a light-emitting diode (LED) could be added tothe PCBA. The case may have an opening, thinning of the plastic, or alens to allow light from the indicator lamp to shine through the case. Alight pipe or light channel could be added.

The background of the invention section may contain backgroundinformation about the problem or environment of the invention ratherthan describe prior art by others. Thus inclusion of material in thebackground section is not an admission of prior art by the Applicant.

Any methods or processes described herein are machine-implemented orcomputer-implemented and are intended to be performed by machine,computer, or other device and are not intended to be performed solely byhumans without such machine assistance. Tangible results generated mayinclude reports or other machine-generated displays on display devicessuch as computer monitors, projection devices, audio-generating devices,and related media devices, and may include hardcopy printouts that arealso machine-generated. Computer control of other machines is another atangible result.

Any advantages and benefits described may not apply to all embodimentsof the invention. When the word “means” is recited in a claim element,Applicant intends for the claim element to fall under 35 USC Sect. 112,paragraph 6. Often a label of one or more words precedes the word“means”. The word or words preceding the word “means” is a labelintended to ease referencing of claim elements and is not intended toconvey a structural limitation. Such means-plus-function claims areintended to cover not only the structures described herein forperforming the function and their structural equivalents, but alsoequivalent structures. For example, although a nail and a screw havedifferent structures, they are equivalent structures since they bothperform the function of fastening. Claims that do not use the word“means” are not intended to fall under 35 USC Sect. 112, paragraph 6.Signals are typically electronic signals, but may be optical signalssuch as can be carried over a fiber optic line.

The foregoing description of the embodiments of the invention has beenpresented for the purposes of illustration and description. It is notintended to be exhaustive or to limit the invention to the precise formdisclosed. Many modifications and variations are possible in light ofthe above teaching. It is intended that the scope of the invention belimited not by this detailed description, but rather by the claimsappended hereto.

1. An enhanced-internal-spacing flash-memory device comprising: an uppercase; a lower case; a printed-circuit board assembly (PCBA) thatcomprises: a circuit board having wiring traces; a flash-memory chipmounted to a first surface of the circuit board; a controller chipmounted to the first surface of the circuit board, the controller chiphaving a input/output interface circuit for interfacing to an externalcomputer, and a processing unit for accessing the flash-memory chip inresponse to commands from the external computer received by theinput/output interface circuit; a switch, mounted to the circuit board,having a sliding tab protruding through the upper case, the sliding tabbeing slidable by a user to indicate to the controller chip to preventwriting to the flash-memory chip; contact pads formed on a secondsurface of the circuit board, the contact pads for connecting thecontroller chip to the external computer; wherein the second surface isopposite the first surface; wherein the upper case is attached to thelower case during assembly with the PCBA between the upper case and thelower case, with the contact pads exposed through contact-pad openingsbetween the upper case and the lower case, the upper and lower casesencapsulating the circuit board; and supporting dividers formed on thelower case between pairs of the contact-pad openings, the supportingdividers supporting the circuit board at a slanting angle to a primarysurface the upper case, wherein the first surface of the circuit boardand the primary surface of the upper case are non-parallel at theslanting angle, wherein the flash-memory chip is block-addressable andnot randomly-addressable.
 2. The enhanced-internal-spacing flash-memorydevice of claim 1 wherein the upper case has an upper exterior surfacethat is a largest external surface on the upper case; wherein the lowercase has a lower exterior surface that is a largest external surface onthe lower case; wherein the upper exterior surface is substantiallyparallel to the lower exterior surface; wherein the first surface andthe second surface of the circuit board are parallel to each other, butare not parallel to the upper exterior surface or to the lower exteriorsurface; wherein the circuit board is mounted within the upper case andlower case at the slanting angle; wherein the switch is mounted to thecircuit board at an inverse angle, the inverse angle being an inverse ofthe slanting angle; wherein the sliding tab slides in a plane that issubstantially parallel to the upper exterior surface due to the switchbeing mounted at the inverse angle to compensate for the slanting angleof the circuit board.
 3. The enhanced-internal-spacing flash-memorydevice of claim 2 further comprising: end supporting ribs formed on thelower case, for further supporting the circuit board at the slantingangle within the lower case; wherein the contact pads are on aninsertion end of the circuit board and the contact-pad openings are onan insertion end of the upper case and the lower case; wherein the endsupporting ribs are formed on the insertion end of the lower case;wherein the first surface of the circuit board faces the lower case andis supported at the slanting angle by the end supporting ribs contactingthe first surface of the circuit board.
 4. The enhanced-internal-spacingflash-memory device of claim 3 wherein a far-end spacing from a far endof the circuit board to the lower exterior surface of the lower case isgreater than an insertion-end spacing from the insertion end of thecircuit board to the lower exterior surface of the lower case, wherebyspacing is increased at the far end by the slanting angle of the circuitboard.
 5. The enhanced-internal-spacing flash-memory device of claim 4wherein the flash-memory chip is mounted to the first surface closer tothe far end than to the insertion end of the circuit board; wherein thefar end of the circuit board is tilted upward by the slanting angle toincrease space for the flash-memory chip between the circuit board andthe lower case, whereby space for the flash-memory chip is increased bythe slanting angle of the circuit board.
 6. Theenhanced-internal-spacing flash-memory device of claim 1 wherein theupper case has an upper exterior surface that is a largest externalsurface on the upper case; wherein the lower case has a lower exteriorsurface that is a largest external surface on the lower case; whereinthe upper exterior surface is substantially parallel to the lowerexterior surface; wherein the circuit board further comprises: a contactsection having the contact pads formed thereon; a main section havingthe flash-memory chip and the controller chip mounted thereon; and aflex transition section between the contact section and the mainsection; wherein the second surface of the contact section and the firstsurface of the main section are substantially parallel to the upperexterior surface or to the lower exterior surface; wherein the flextransition section is bendable and is not parallel to the upper exteriorsurface.
 7. The enhanced-internal-spacing flash-memory device of claim 6wherein a first spacing from the first surface of the main section tothe lower case is larger than a second spacing from a first surface ofthe contact section to the lower case, whereby spacing is increased atthe main section relative to the contact section by flexibility of theflex transition section.
 8. The enhanced-internal-spacing flash-memorydevice of claim 7 wherein the main section is formed from a first rigidcircuit board that is inflexible; wherein the contact section is formedfrom a second rigid circuit board that is inflexible; wherein the flextransition section is formed from a carrier substrate that is flexibleand thinner than a thickness of the first rigid circuit board.
 9. Theenhanced-internal-spacing flash-memory device of claim 7 wherein thecontact section is formed from a rigid circuit board that is inflexible;wherein the main section is formed from a carrier substrate that isflexible and thinner than a thickness of the rigid circuit board;wherein the flex transition section is formed from the carriersubstrate.
 10. The enhanced-internal-spacing flash-memory device ofclaim 7 wherein the main section is formed from a carrier substrate thatis flexible and thinner than a thickness of a rigid circuit board;wherein the flex transition section is formed from the carriersubstrate; wherein the contact section is formed from the carriersubstrate.
 11. The enhanced-internal-spacing flash-memory device ofclaim 1 wherein the contact pads form a physical interface for aSecure-Digital flash card interface or an extension of a Secure-Digitalflash card interface without digital-rights-management support.
 12. Theenhanced-internal-spacing flash-memory device of claim 1 wherein thecontact pads form a physical interface for a compact flash, serial ATattachment (SATA), PCI Express, ExpressCard, or Firewire (IEEE 1394)interface.
 13. The enhanced-internal-spacing flash-memory device ofclaim 1 further comprising: ultrasonic ridges formed on sidewalls of theupper case; wherein the ultrasonic ridges bond into the lower case inresponse to frictional heating when the upper case is ultrasonicallyvibrated with respect to the lower case during assembly toultrasonically bond the upper case into the lower case; whereby theupper case and the lower case are assembled by an ultrasonic bondingmethod.
 14. A thin flash-memory device comprising: upper case means forpartially encasing the thin flash-memory device; lower case means forpartially encasing the thin flash-memory device; main circuit boardmeans for connecting chips with wiring traces; secondary circuit boardmeans for connecting pads with wiring traces; flash-memory chip meansfor storing blocks of data, the flash-memory chip means being mounted toa first surface of the main circuit board means, wherein theflash-memory chip means are block-addressable and notrandomly-addressable; controller chip means, mounted to the firstsurface of the main circuit board means, for controlling access to theflash-memory chip means, the controller chip means comprising aninput/output interface means for interfacing to an external computer,and processing unit means for accessing the flash-memory chip means inresponse to commands from the external computer received by theinput/output interface means; switch means, mounted on the main circuitboard means, having a switch tab that slides, for indicating to thecontroller chip means to prevent writing to the flash-memory chip means;and contact pad means, formed on a second surface of the secondarycircuit board means, for connecting to the external computer.
 15. Thethin flash-memory device of claim 14 further comprising: slant means,formed on the upper case means, for supporting the main circuit boardmeans at a slanted angle to a centerline between the lower case meansand the upper case means, wherein the main circuit board means isslanted and not parallel to the centerline; wherein the main circuitboard means and the secondary circuit board means together comprise arigid printed-circuit board; wherein the upper case means is attached tothe lower case means during assembly with the main circuit board meansbetween the upper case means and the lower case means, with the contactpad means passing through a plurality of openings in the upper casemeans; wherein the switch means further comprises compensating-anglemount means for mounting the switch means to the main circuit boardmeans at a compensating angle, the compensating angle for compensatingfor the slanted angle of the slant means, whereby compensating-anglemount means compensates for the slanted angle so that the switch tabslides within the switch means in a substantially parallel motion withrespect to the upper cases means.
 16. The thin flash-memory device ofclaim 15 wherein the flash-memory chip means and the controller chipmeans are located in a first region having the main circuit board meansfarther above the centerline than the secondary circuit board means,wherein the contact pad means is formed on the secondary circuit boardmeans, whereby the circuit board means is slanted.
 17. The thinflash-memory device of claim 16 wherein the slant means comprises:divider means, formed on the upper case means between the plurality ofopenings in the upper case means, for supporting the second surface ofthe circuit board means at a slanted angle to the upper case means. 18.The thin flash-memory device of claim 14 further comprising: flextransition section means for connecting the main circuit board means tothe secondary circuit board means, wherein the flex transition sectionmeans comprises a flexible carrier substrate that bends to increasespacing for the flash-memory chip means and the controller chip means tothe lower case means.
 19. The thin flash-memory device of claim 18wherein the main circuit board means and the secondary circuit boardmeans together comprise a rigid printed-circuit board.
 20. The thinflash-memory device of claim 18 wherein the main circuit board meanscomprises a rigid printed-circuit board; wherein the secondary circuitboard means comprises a flexible carrier substrate that is an extensionof the flex transition section means.
 21. The thin flash-memory deviceof claim 18 wherein the main circuit board means comprises a flexiblecarrier substrate that is an extension of the flex transition sectionmeans; wherein the secondary circuit board means comprises a flexiblecarrier substrate that is an extension of the flex transition sectionmeans.